SPECIFICATIONS
Board Form Factor Mini-ITX
Socket LGA1155
Max TDP 65 W
Memory
•Two 240-pin DDR3 SDRAM Dual Inline Memory Module (DIMM) sockets
•Support for DDR3 1333 /1066 MHz DIMMs
•Support for up to 8 GB of system memory
Chipset Intel® H61 Express Chipset
Audio Intel® High Definition Audio (Intel® HD Audio) subsystem in the following configuration:
•6-channel (5.1) audio subsystem with three analog audio outputs using the Realtek ALC892* audio codec
Graphics DVI-D and VGA connectors for processors with Intel® HD Graphics
LAN support Gigabit (10/100/1000 Mbits/sec) LAN subsystem using the Intel® 82579V Gigabit Ethernet Controller
Peripheral interfaces
•Two USB 3.0 ports
•Up to eight USB 2.0 ports
•Three Serial ATA 3.0 Gb/s ports
•One serial header
•One parallel port
•One PS/2 Port
Expansion capabilities
•One PCI Express 2.0 x 1 connectors
•One PCI Express Mini-card slot